Scientific Equipment Solutions
Atomic Layer Deposition (ALD) Equipment
An advanced multi-chamber atomic layer deposition system used to create ultra-thin material films for semiconductor manufacturing and packaging.
This independently developed semiconductor manufacturing equipment features three dual-station reaction chambers. It is engineered for advanced chip manufacturing, advanced packaging (TSV), and front-end-of-line (FEOL) processes. The system is capable of producing high-quality PEALD silicon dioxide (SiO2) and silicon nitride (SiN) films.